Briefing on TVET Placement and TalentCorp Incentives: MySIP & LIKES

Complimentary session to MISIF members on the latest initiative from Government-Industry TVET Coordination Body (GITC) and Ministry of Human Resources (KESUMA) on TVET Placement and relevant TalentCorp incentives: National Structured Internship Programme (MySIP) and the Internship Placement Matching Grant for SMEs & Start-ups (LIKES), aiming to match technical and vocational job seekers with reputable industry employers and accredited upskilling courses. Details on the session are as below:

Date: 17 December 2025 (Wednesday)
Time: 10.00 am – 11.15 am
Mode: Online (Zoom)
Registration link: https://forms.gle/khhHRSNfj96qnt9z8

Register now!

Discover more from Malaysian Iron and Steel Industry Federation

Subscribe now to keep reading and get access to the full archive.

Continue reading